Peraso Raises $20M Series C Financing Co-Led by Integrated Device Technology (IDT) and Roadmap Capital

April 21, 2016

Semiconductor company Peraso Technologies Inc. announced that it has raised a $20 million funding round. The round was co-led by US semiconductor company IDT (IDTI on NASDAQ) and existing investor Roadmap Capital with additional financing from iNovia Capital.

Peraso is in production with WiGig® IC solutions, addressing both next generation WiFi opportunities in the consumer electronics (CE) space, as well as outdoor devices in the 60 GHz wireless infrastructure space, said the company. The investment will be used to increase the company’s capacity to address the significant customer interest in all of the targeted market opportunities, including smart phones and virtual reality (VR).

“The interest we’re seeing in WiGig® is tremendous,” said a statement from Ron Glibbery, President and CEO of Peraso. “Multi-Gigabit wireless connectivity is something that more and more CE and wireless infrastructure manufacturers are seeking to incorporate in their products. Raising this capital allows Peraso to take our sales to the next level. Participation by IDT provides further validation of the market opportunity, and continued participation from Roadmap, as well as iNovia, speaks to the tremendous success the company has demonstrated in getting our first ICs to market.”

LaBarge Weinstein acted as counsel to Peraso with a team that included Michael Dunleavy, Colin Wrynn and Taisha Lewis.

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